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IFTLE 264 2015 GaTech Interposer Conf Part 2: The Status of Glass
By Dr. Phil Garrou, Contributing Editor The GaTech group ad many of their members have been studying the applicability of glass as 2.5D interposers for several years now. Some of the papers presented...
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IFTLE 266 IMAPS Goes Searchable; GaTech Interposer Conf Part 3
By Dr. Phil Garrou, Contributing Editor IMAPS now “Googleable” Of upmost importance to researchers at Universities, Research Institutes and even Commercial Companies is the ability of others to find...
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IFTLE 267 The 2015 IWLPC: DECA, SPTS, IMEC / KLA-Tencor, IMEC / EVG
By Dr. Phil Garrou, Contributing Editor This week, let’s take a quick look at the 12th annual Int. Wafer Level Packaging Conference (IWLPC) which was held in San Jose in October. But before we do, a...
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IFTLE 268 IMAPS 2015 Part 1: A Comeback for WLP in IoT
By Dr. Phil Garrou, Contributing Editor IMAPS 2015 also known as the 48th International Symp on Microelectronics was held this past Oct in Orlando, FL. Umi Ray of Qualcomm was General Chair and Erika...
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IFTLE 269 IMAPS 2015 Part 2 High Density Packaging ASE STATS Nanium
By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2015 IMAPS Conference. YOLE Advanced packaging has increased in complexity over the years, transitioning from single to multi die...
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IFTLE 270 IMAPS 2015 Part 3: High Density PCB Technologies; Unimicron, Princo
By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2015 IMAPS Conference. Unimicron Unimicron discussed their continued development of < 5/5 L/S for polymeric interposer...
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IFTLE 271 IMAPS 2015 Part 4: Scallop-less Etching; Gold Sealing; PI vs PBO; TLPS
By Dr. Phil Garrou, Contributing Editor Finishing our look at IMAPS 2015… ULVAC – TSV etching ULVAC has developed an etch tool capable of both Bosch etching and their “direct etch” process. Direct etch...
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IFTLE 272 2015 3D ASIP Part 1: Pioneer Awards; Sony 3D stacked CIS; Latest on...
By Dr. Phil Garrou, Contributing Editor Beginning coverage on the 2015 3D ASIP (Architectures for Semiconductor Interconnect and packaging) conference sponsored by RI Int which is the final major high...
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IFTLE 273 Samsung Announces HBM2 DRAM; 3D ASIP Part 2 Prismark
By Dr. Phil Garrou, Contributing Editor Samsung announces 4GB HBM2 DRAM Samsung Electronics announced that it has begun mass producing the industry’s first 4-gigabyte (GB) DRAM package based on the...
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IFTLE 274 3D ASIP 2015 Part 4: Comparing Memory Architectures; On the Passing...
By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2015 3D ASIP conference, one of the themes of this years conference was the coming of age of 3D stacked memory which now comes in...
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IFTLE 275 3D ASIP 2015 Part 5: The Memory Suppliers
By Dr. Phil Garrou, Contributing Editor Finishing up our look at the 2015 3D ASIP, conference we’ll look at the presentations from some of the memory suppliers and users. Toshiba Higashi form Toshiba...
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IFTLE 276 SEMI ISS 2016: The Focus Shifts to Packaging
By Dr. Phil Garrou, Contributing Editor The annual SEMI ISS (Industry Strategy symposium) meeting took place as usual in January in Half Moon Bay CA. What was different was something that IFTLE has...
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IFTLE 277 SEMI ISS 2016 Part 2: Scaling Under Pressure; Tsinghua Bets on...
By Dr. Phil Garrou, Contributing Editor Continuing our look at the SEMI 2016 ISS meeting. Pacific Crest Daniel Bakshet of Pacific Crest Securities pointed to the following changes in the semiconductor...
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IFTLE 278 Omnivision Stacked CIS; Apple Fingerprint Sensor with TSV
By Dr. Phil Garrou, Contributing Editor Sony Samsung and Omnivision are locked in a technology battle for superiority in CMOS image sensors. While Sony has the lead in stacking technology, i.e....
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IFTLE 279 2016 European 3D Summit: Cost Modeling Memory Stacks; Needed Tech...
By Dr. Phil Garrou, Contributing Editor Let’s take a look at some of the key presentations from the 2016 SEMI European 3D Summit that took place in January. System Plus Consulting System Plus...
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IFTLE 280 2016 European 3D Summit: Economic Profit in Today’s Micro electronics
By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2016 SEMI European 3D Summit. McKinsey A very interesting chart from McKinsey on 2014 economic profit in the microelectronics industry...
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IFTLE 281 ASE Takeover of SPIL Halted But Not Stopped; After Silicon Scaling...
By Dr. Phil Garrou, Contributing Editor The Taipei Times is reporting that the Taiwan Fair Trade Commission has suspended its review of ASE’s bid to take over SPIL (link). ASE’s prior acquisition of a...
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IFTLE 282 Unique GaN Packaging Solutions from HRL
By Dr. Phil Garrou, Contributing Editor Wide band gap semiconductors are extremely attractive for power electronics applications. GaN is a binary III-V wide-band gap ( 3.4 eV) material. Since GaN...
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IFTLE 283 Will Packaging Make the Difference for TSMC?
By Dr. Phil Garrou, Contributing Editor The Taipei Times headline on April 18th read “New packaging may spur TSMC growth” adding that despite its weak revenue growth guidance for this quarter, TSMC,...
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IFTLE 284 IMAPS DPC 2016: Amkor and Global TSV in Manuf; Leti Stacking of Caps
By Dr. Phil Garrou, Contributing Editor The IMAPS Device Packaging Conference was once again held in March in Arizona. Here is a look at some of the more interesting papers from the conference. AMKOR –...
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