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IFTLE 244 3D Stacked CMOS Image Sensors; IEEE 3DIC Conf
By Dr. Phil Garrou, Contributing Editor At the recent 2015 Int Image Sensor Workshop, Ray Fontaine of Chipworks presented a review of “The State-of-the-art of Mainstream CMOS Image Sensors” Chipwork’s...
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IFTLE 245 2015 IEEE ECTC part 1 Thermo compression Bonding
By Dr. Phil Garrou, Contributing Editor Over the next few weeks of the summer, I will be covering as much of the 65th IEEE ECTC as I can. They call themselves the “Premier International Packaging...
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IFTLE 246 ECTC 2: IMEC 2.5/3D Process Developments and Low Temp Bonding for...
By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2015 ECTC: Kaiung Paik – KAIST and Jay Im – U Texas Nancy Stoffel – GE, Chris Bower & Carl Heinz Bock –Emerging Tech Committee...
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IFTLE 247 ECTC part 3: More Thermo Compression Bonding from Intel and ASM
By Dr. Phil Garrou, Contributing Editor In IFTLE 245, we looked at some of the key thermo-compression bonding (TCB) papers at ECTC. Is there any question that TCB is real and will be the next big...
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IFTLE 248 ECTC 4 Oxidation of EMC in Thin Packages; Compression Molding Large...
By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2015 ECTC. Freescale – High Temperature Storage of Ultra-Thin Molded Array Packages Ultra-thin molded array packages (TMAP) with...
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IFTLE 249 Merger Mania or Simple Economics? ; Wide Band Gap Semiconductors...
Merger Mania or Economics 101? SST has recently shared an article by IC Insights entitled “Tsunami of M&A deals underway in the semiconductor industry in 2015.” [link] While IFTLE certainly agrees...
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IFTLE 250 Toshiba Extends TSV Stacks to NAND; UMC to Supply TSV Based Silicon...
By Dr. Phil Garrou, Contributing Editor Wow, the big 250! Thanks to all of you that continue to read my updates and opinions. Thanks to all of those who have supplied me information to pass on to all...
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IFTLE 251 3DIC NAND vs 3D V-NAND
By Dr. Phil Garrou, Contributing Editor A few years ago in IFTLE 62, we laughed when EE Times reporters got confused and unknowingly compared 3DIC to 3D finfets thinking they were the same thing. Well,...
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IFTLE 252 ASE Makes Bid for Siliconware Shares; TSMC/Huawei 2.5D Networking...
By Dr. Phil Garrou, Contributing Editor ASE seeking ~ 25% stake in SPIL By now, you have seen the news that ASE has made an offer to buy up to 25% of the shares of competitor SPIL at a 34% premium....
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IFTLE 253 China Inc Seeks to Acquire GF; Tessera Acquires Ziptronix; Tezzaron...
By Dr. Phil Garrou, Contributing Editor China targets GlobalFoundries In IFTLE 238, we noted that China was the “wild card” when it came to global microelectronics consolidation – with plenty of cash...
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IFTLE 254 Semicon Taiwan Part 1; GaTech Interposer Workshop
By Dr. Phil Garrou, Contributing Editor System Integration by 3D SiP The forum chairman was CP Hung, who is currently the VP of Corporate R&D for ASE Group, responsible for next generation products...
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IFTLE 255: Consolidation continues; ASE acquires SPIL stock; Semicon Taiwan...
By Dr. Phil Garrou, Contributing Editor Consolidation One may say that IFTLE has been obsessed with consolidation for the last few years. The reasons for this become obvious when one looks at the...
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IFTLE 256: Semicon Taiwan part 3 – substrate and panel processing by...
By Dr. Phil Garrou, Contributing Editor This week lets finish our look at the substrate and panel level processing activities at Semicon Taiwan 2015’s Embedded and Wafer Level Package Technology Forum....
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IFTLE 257: IC Insights’ McClean Report Forecast Revisions
By Dr. Phil Garrou, Contributing Editor IC Insights’ fall revisions to the 2015 Forecast For nearly two decades, the industry has eagerly awaited the yearly release (early in the first quarter of each...
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IFTLE 258: IEEE 3DIC Sendai Japan; GINTI
By Dr. Phil Garrou, Contributing Editor The official IEEE 3DIC meeting started in 2009. It rotates from the USA to Europe to Asia on an annual basis. I say official because we all know that “3DIC” has...
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IFTLE 259: IEEE 3DIC 2015 part 2 – DARPA , Xilinx, Tohoku Univ, IMEC/Samsung,...
DARPA In his presentation “Path to 3D Heterogeneous Integration” Dan Green, DARPA program manager described their motivation for heterogeneous integration. Modern RF systems are under pressure to make...
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IFTLE 260: IMPACT Taiwan 2015 – Altera, iNEMI, SPIL
IMPACT Taiwan The IMPACT conference claims to be the largest gathering of packaging and PCB professionals in Taiwan. It is organized by IEEE CPMT, ITRI, IMAPS Taiwan and the Taiwan Printed Circuit...
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IFTLE 261 Consolidation Continues; the Info on InFO?; RTI 3D ASIP
By Dr. Phil Garrou, Contributing Editor Consolidation in our maturing industry is the ONE most important this that is happening to microelectronics in the 21st century because this is/will set the...
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IFLE 262 SEMICON Europa part 1; Update on G450, Panasonic Plasma Dicing; Thin...
By Dr. Phil Garrou, Contributing Editor G450 – 450mm wafer status report For most of us, whether we work in the FEOL or in packaging, what we want to know about the attempted move to 450mm wafers is...
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IFTLE 263 GIT 2015: High Density Laminates and Lasers – Kyocera, ESI, Suss
By Dr. Phil Garrou, Contributing Editor The Georgia Tech High Density Interposer Technology conference (GIT) held a few weeks ago in Atlanta. Traditionally it has been a great place to compare and...
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